All Participants Issuers, Arrangers, Investors and Custodians are hereby informed that the Exchange has made available “BSE BOND” with effect from July 01, 2016 in line with SEBI circular no. CIR/IMD/DF1/48/2016 dated April 21, 2016 regarding Mechanism for issuance of debt securities on private placement basis through an Electronic Book Mechanism (“EBM”).
The BSE BOND platform has been upgraded as per nomenclatures entailed in the circular no: SEBI/HO/DDHS/CIR/P/2018/05 issued by SEBI on January 05, 2018. Detailed operating guidelines for BSE BOND platform were issued on March 28, 2018.
Please find appended below the revised operational guidelines for participation in “BSE BOND” of BSE in Annexure A. The guidelines also exhibit the requirements to be complied by Issuer(s)/ Arranger(s)/ QIB/Non-QIB investors/ Custodians intending to select the Electronic Bidding Platform (“EBP”) of BSE- BSE BOND for issuances of securities on private placement basis.
The updated Operational Guidelines incorporates requirement of minimum bid lot for Non Banking Financial Company (NBFC) and Housing Finance Company (HFC) and revised Settlement Calendar on T+1 basis.
The updated Operational Guidelines will be applicable to all issues announced and notified on or after April 27, 2018.
For any further clarifications, Issuer(s)/ Arranger(s)/ QIB/Non-QIB investor(s) / Custodian(s) may contact following officials at the Exchange:
Bhushan Mokashi
Additional General Manager
Listing Sales and Ops
April 24, 2018 |